Process Capabilites
- Smallest Via hole sizes down to
- General PCB ---- 0.0118” By CNC Drill
- Flexible PCB ---- 0.006” By CNC Drill
- Build up PCB ---- 0.002” By Laser Drill , Blind & Buried via holes
- Minimum Thickness
- Double side board ---- 0.0078”
- 4 Layers Epoxy ---- 0.0157”
- 6 Layers Flexible ---- 0.0157”
- Line width and spacing down to
- General PCB ---- 0.005”
- Flexible PCB ---- 0.002”
- Line width tolerance of less than 0.0005” for Impedance Controlled Applications
- 60 Ohm +/- 10% for BGA PCB
- Heavy copper & Aluminum Metal ---- 12oz Etching line.
- Maximum board size of 18” x 24”
- Line width tolerancing of 0.0005” for Controlled Impedance Applications
- Line width and spacing down to 0.005”/0.005”
- Quality Control Laboratory for In-Process Analysis and Micro-sectioning
- Solder Mask pad Opening that is 0.0035” larger than the conductor pad
- In-House Electrical Testing
- Surface Mounting Technology
- Selective Gold & Electro less Gold
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