Process Capabilites

  • Smallest Via hole sizes down to
    • General PCB ---- 0.0118” By CNC Drill
    • Flexible PCB ---- 0.006” By CNC Drill
    • Build up PCB ---- 0.002” By Laser Drill , Blind & Buried via holes
  • Minimum Thickness
    • Double side board ---- 0.0078”
    • 4 Layers Epoxy ---- 0.0157”
    • 6 Layers Flexible ---- 0.0157”
  • Line width and spacing down to
    • General PCB ---- 0.005”
    • Flexible PCB ---- 0.002”
  • Line width tolerance of less than 0.0005” for Impedance Controlled Applications
    • 60 Ohm +/- 10% for BGA PCB
  • Heavy copper & Aluminum Metal ---- 12oz Etching line.
  • Maximum board size of 18” x 24”
  • Line width tolerancing of 0.0005” for Controlled Impedance Applications
  • Line width and spacing down to 0.005”/0.005”
  • Quality Control Laboratory for In-Process Analysis and Micro-sectioning


  • Solder Mask pad Opening that is 0.0035” larger than the conductor pad
  • In-House Electrical Testing
  • Surface Mounting Technology
  • Selective Gold & Electro less Gold